P74009/ZF 型红外焦平面探测器自动粘片机

P74009/ZF  Infrared Focal Plane Detector Automatic Die Bonder

玻璃基板尺寸 Glass base plate size3″/4″/6″,厚度 thickness 4mm~7mm
晶片材料 Crystal chip material碲锌镉、锑化铟 CdZnTe、 InSn
晶片尺寸 Crystal chip size规则晶片 Regular crystal chip 3×10mm(Min)80×80mm(Max)
不规则晶片 Irregular crystal chip(圆弧直径 Arc diameter)≤120mm
加热温度 Heating temperature25℃~80℃(可定可调 adjustable)
陪边 Edge规则晶片要有陪边: 4 条,宽度 4mm
The regular crystal chip with edges: 4, thickness 4mm
陪边要求 Edge requirement100 倍放大镜检测下人工辅助完成无明显缝隙拼接
Accomplish no obvious gap splicing manually under the test by 100 times magnifying glass
Application: the automatic die bonder is mainly used to bond CdZnTe and InSn Infrared crystal chip automatically.
The crystal chip surface is parallel with the base plate surface. Tolerance≤2µm (Flatness of the crystal chip and the base plate ≤2µm) 
粘接完固化采用常温自然冷却 solidification after bonding uses natural cooling in normal temperature
The equipment composition: the base, material feeding mechanism, grab mechanism, wax dripping mechanism, rotary chip stage, extruding mechanism, unloading mechanism, 3D platform, marble table, material discharging position, protection door cover and electrical control system etc.